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Laser-generated surface acoustic waves in copper interconnect structures on silicon wafers

Laser-generated surface acoustic waves in copper interconnect structures on silicon wafers

par Alex Maznev - Philips Advanced Metrology Systems, Natick, USA

le Mardi 27 Mai 2008 à 16:30 Salle IAM 4ième étage

Résumé :

Copper wires connecting devices on integrated circuits constitute one of the critical components of the state-of-the-art silicon technology. Today, measurement systems utilizing laser-generated acoustic waves are widely used by semiconductor industry to control various stages of copper interconnect fabrication. In this talk, I will review surface acoustic wave (SAW) measurements of simplest structures, i.e. periodic arrays of copper lines embedded in a dielectric film, performed using laser-induced transient grating technique. We will see that apart from their practical importance these measurements contain some interesting physics. Three main classes of wave propagation phenomena will be considered : (i) SAWs in periodic structures with period much smaller than the acoustic wavelength, with a discussion of the effective medium approach and its limitations. (ii) Phononic bandgaps and other spectacular phenomena observed on structures with period comparable to the acoustic wavelength. (ii) Waveguide modes in individual copper lines.

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